Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.
Last Updated： Aggregation Period:Jul 22, 2026～Aug 18, 2026
This ranking is based on the number of page views on our site.
1～11 item / All 11 items
It etches locally and with high precision within the substrate surface.
Scia Systems GmbH was established by key staff who developed the software and hard wafers for the ion beam trimming (trimming processing, IBF) device IonScan from Roth&Rau AG and MicroSystems GmbH. Scia Systems develops unique and proprietary cutting-edge ion beam and plasma technologies, handling equipment from research and development to mass production.
Achieving more diverse, faster, and higher precision cutting processing! NC high-speed precision automatic cutter and trimming machine!
Achieving "variable cut adjustment" with bottom dead center shifting and bottom dead center stop functions. Making faster, more diverse, and higher precision cutting processes more accessible. 【Features】 ■ All bottom dead center adjustments and lateral adjustments are digitalized ■ Achieves full cut and half cut without moving the lower plate ■ Windows control designed for convenience (equipped with a large display) ■ Realizes diverse processing with variable cut function ■ Adopts a plate rotation mechanism at the cutting point ■ Navigates the end time of production ■ 0.001mm blade height adjustment mechanism (optional) ■ Reduces CO2 with "eco mode" that cuts standby power by 15% (optional) ■ Automatic start function for material insertion and head positioning (optional) *For details, please request materials or view the PDF data from the download.
Flatten the wafer surface and remove irregularities with ion beam
This wafer trimming equipment contributes to precision machining because it can flatten the unevenness of the wafer surface to σ=1.0nm or less by irradiating a φ4 inch or φ6 inch wafer with converged ion beam.
The combination of lasers and robots enables trimming of various shapes!
We offer the laser trimming machine "LTM Series" as a 3D shape film trimming technology. It is capable of trimming from TOM molding to trimming skins for insert molding. It is also suitable for post-processing after TOM molding, allowing for skin cuts without damaging the substrate. 【Features】 ■ Collaboration between a 6-axis controlled robot and laser marker drive - Trimming time is significantly reduced - Ideal for skin cutting in insert molding. No special molds or blades are required - Designed with compactness and safety in mind, ensuring safe operation *For more details, please download the PDF or contact us.
We pursue the latest laser technology and its application possibilities as the core of the photonics business within the HOYA Group, focusing on industry and healthcare.
Electronic products that support our lives. With their development, our lifestyles have also changed. The evolution of these electronic products is brought about by advancements in precision processing technology. We provide high-precision microprocessing that was not achievable with conventional processing techniques using lasers. In addition, leveraging our uniquely developed system technology, we manufacture and sell laser processing equipment for LCD substrate repair, IC wafer marking, semiconductor trimming, and cutting, accumulating numerous achievements and gaining trust. We will continue to pursue further possibilities in laser processing to assist in enriching your lives. Custom-made production and sales of various systems are available to meet your needs.
Mechanical clamp or electrostatic chuck compatible! Sub-nanometer etching mechanism.
The "scia Trim 200" is an ion beam trimming device that controls film thickness etching with high precision and high throughput. It supports wafer substrates up to 200mm, improving yield. Additionally, the process is ion beam trimming (IBT). Please feel free to consult us when needed. 【Features】 ■ Supports wafer substrates up to 200mm ■ Yield improvement ■ Film thickness etching control with high precision and high throughput ■ Compatible with mechanical clamps or electrostatic chucks ■ Sub-nanometer etching mechanism *For more details, please refer to the PDF document or feel free to contact us.
Essential for casting equipment! A trimming machine that can handle not only aluminum casting but also cast iron.
The "trimming machine" is capable of handling not only aluminum casting but also cast iron through the application of our technology. Typically, using a trimming machine with cast iron leads to significant wear on the press molds, resulting in higher costs. However, by utilizing our provided "TD process," it can also accommodate cast iron. 【Features】 ■ Compatible with aluminum casting ■ Can handle cast iron by using the "TD process" *For more details, please refer to the catalog or feel free to contact us.
High-performance, high-efficiency machine! Space-saving and energy-saving type punching device.
The "WP-1000A-10T(7T), WP-800A-7T model" is a punching device that boasts excellent operability for setup changes while meeting the needs of the times with its space-saving design. - Stabilization of product feeding and prevention of misalignment - High cycle capability - Improved operability and maintainability
Achieving short delivery times and low prices through mass production. Capable of flexible customization according to needs. Over 1,600 units sold.
The "HiPA Laser Trimmer" is a device that supports a wide range of applications, including thick film, thin film, low resistance, and ultra-low resistance, achieving high-precision trimming processing. The lineup includes five types: "Thick Film," "Thick Film Ultra-Low Resistance," "Thin Film," "Large Substrate Alloy Ultra-Low Resistance," and "Sheet-Type Alloy Ultra-Low Resistance," covering a measurement range from 0.1Ω to 10MΩ. Equipped with a wealth of algorithms and control functions, as well as our self-developed MOPA laser, it also supports flexible customization. We provide prompt after-sales service. 【Features】 ■ Five product lineups compatible with thick film, thin film, and alloys ■ Equipped with our self-developed MOPA fiber laser and high-precision measurement mechanism ■ Supports pulse widths from 2ns to 500ns and a wide measurement range (0.1Ω to 10MΩ) ■ Over 1,600 units sold, with numerous achievements both domestically and internationally ★ Currently, we are offering free test processing. Please feel free to contact us if you are interested. *For product details, please refer to the materials. Feel free to reach out with any inquiries.
We achieve excellent film thickness uniformity using a self-developed ion source.
Principle: DC-based Ion Milling Features: Simple and robust structure Quick response time (depending on the amount of cutting) Zero etching capability Simple maintenance with DC-based source (gridless, filamentless) Applications: Thickness adjustment of temperature compensation layers (SiO2) for SAW filters, thickness adjustment of LTO, AlN films, etc. Thickness and frequency adjustment of piezoelectric films such as AlN and LTO Thickness adjustment of other conductive and non-conductive films Delivery Record: Japan: Multiple units Overseas: Numerous units delivered
